AAMI Foundation Introduces Scholarship Fund for Packaging Engineering

The AAMI Foundation has announced the establishment of the Michael Scholla Packaging Engineering Scholarship Fund, aimed at supporting students dedicated to careers in packaging engineering. This initiative, launched on December 10, 2025, invites contributions from individuals and organizations within the packaging and life sciences sectors to help shape the future of healthcare packaging professionals.

In its first year, the scholarship will provide $3,000 to a qualified student who has demonstrated a commitment to a career in medical device or pharmaceutical packaging. Interested candidates must submit their applications by February 15, 2026. The selected recipient will have the opportunity to attend the upcoming AAMI neXus conference in April 2026. Should they choose to attend, the Foundation will cover the registration fee and accommodation, facilitating valuable connections with mentors, innovators, and potential employers at this prominent industry event.

Honoring a Leader in Medical Packaging

The scholarship fund is named in honor of Michael “Mike” H. Scholla, PhD, a respected figure in the sterile medical packaging field and an Emeritus Medical Packaging Fellow at DuPont Medical Packaging. Dr. Scholla was a longstanding leader within AAMI and the medical device community, known for his contributions to the advancement of the field and his mentorship to emerging professionals.

Ralph J. Basile, representing the AAMI Foundation, emphasized the significance of healthcare packaging: “Healthcare packaging is mission-critical; it protects patients, preserves product integrity, and supports safe use in clinical settings.” He noted that contributions to the scholarship fund represent a direct investment in the next generation of packaging engineering talent.

While the inaugural year will see one scholarship awarded, the AAMI Foundation plans to expand the program as the fund grows. Basile referenced the success of the Foundation’s existing Miller HTM Scholarship program, which began in 2009 with a limited number of recipients and has since awarded 20 scholarships in 2025, the highest number to date.

Supporting Future Talent

The AAMI Foundation is actively encouraging support from both corporate and individual donors to bolster the future of healthcare packaging. Contributions can be made online, and those seeking further information about recognition opportunities or fund specifics are invited to contact the Foundation directly at [email protected]. Media inquiries can be directed to the AAMI media team at [email protected].

Through the Michael Scholla Packaging Engineering Scholarship Fund, the AAMI Foundation aims to foster a new generation of professionals dedicated to advancing the vital field of healthcare packaging.